The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT, inclosure_material: CERAMIC, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: FLAT PACK, terminal_surface_treatment: SOLDER. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-232-3425, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| features_provided | PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 28 FLAT LEADS |
| time_rating_per_chacteristic | 80.00 NANOSECONDS MAXIMUM ACCESS NS |
| part_name_assigned_by_controlling_agency | PROGRAMMABLE PAL |
| voltage_rating_and_type_per_characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-232-3425 |
| FEATURES PROVIDED | PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT |
| TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM ACCESS NS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
| INCLOSURE CONFIGURATION | FLAT PACK |
| TERMINAL SURFACE TREATMENT | SOLDER |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | PROGRAMMABLE PAL |
| MEMORY DEVICE TYPE | PAL |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |