CA3083F: SEMICONDUCTOR DEVICES,UNITIZED.
The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, mounting_method: TERMINAL, special_features: ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PNP, component_name_and_quantity: 5 SEMICONDUCTOR DEVICE DIODE, power_rating_per_characteristic: 750.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR, maximum_operating_temp_per_measurement_point: 125.0 CELSIUS AMBIENT AIR DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-026-2435, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| mounting_method | TERMINAL |
| special_features | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PNP |
| component_name_and_quantity | 5 SEMICONDUCTOR DEVICE DIODE |
| power_rating_per_characteristic | 750.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR |
| current_rating_per_characteristic | 20.00 MILLIAMPERES MAXIMUM BASE CURRENT, INSTANTANEOUS AND 100.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, INSTANTANEOUS ALL SEMICONDUCTOR DEVICE DIODE |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-01-026-2435 |
| SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| MATERIAL | CERAMIC ENCLOSURE |