C57402J/883B: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.293 INCHES NOMINAL IN, body_height: 0.158 INCHES NOMINAL IN, body_length: 0.898 INCHES NOMINAL IN, features_provided: HIGH SPEED AND ASYNCHRONOUS AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-273-3103, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.293 INCHES NOMINAL IN |
| body_height | 0.158 INCHES NOMINAL IN |
| body_length | 0.898 INCHES NOMINAL IN |
| features_provided | HIGH SPEED AND ASYNCHRONOUS AND HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-273-3103 |
| INPUT CIRCUIT PATTERN | 9 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.293 INCHES NOMINAL IN |
| BODY HEIGHT | 0.158 INCHES NOMINAL IN |
| FEATURES PROVIDED | HIGH SPEED AND ASYNCHRONOUS AND HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.898 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.