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C57401AW883B — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

C57401AW883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND RESETTABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-123-7983, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
C57401AW883B
NSN: 5962-01-123-7983
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length0.440 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND RESETTABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeFIRST-IN FIRST-OUT
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern7 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-123-7983
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN C57401AW883B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 7 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND RESETTABLE
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: FIRST-IN FIRST-OUT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN7 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND RESETTABLE
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEFIRST-IN FIRST-OUT
BODY LENGTH0.440 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 5
10133940Reference document
Same NSN cross-reference
Reference document — Informative reference only
CSF195Reference document
Same NSN cross-reference
Reference document — Secondary reference
CSF198Reference document
Same NSN cross-reference
Reference document — Secondary reference
C57401W/883BReference document
Same NSN cross-reference
Reference document — Secondary reference
FD-1465Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is C57401AW883B?
C57401AW883B is a MICROCIRCUIT,MEMORY.
What parts can replace C57401AW883B?
There are 5 known substitutes for C57401AW883B: 10133940, CSF195, CSF198 and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for C57401AW883B?
C57401AW883B is cataloged in the U.S. Government catalog under NSN 5962-01-123-7983. This indicates validated use in U.S. government and defense supply chains.
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