C57401AJ — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

C57401AJ: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES NOMINAL IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.968 INCHES NOMINAL IN, features_provided: ASYNCHRONOUS AND EXPANDABLE AND ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, memory_device_type: FIRST-IN FIRST-OUT. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-263-3545, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

C57401AJ

NSN: 5962-01-263-3545
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.285 INCHES NOMINAL IN
body_height	0.200 INCHES MAXIMUM IN
body_length	0.968 INCHES NOMINAL IN
features_provided	ASYNCHRONOUS AND EXPANDABLE AND ELECTROSTATIC SENSITIVE
inclosure_material	CERAMIC
memory_device_type	FIRST-IN FIRST-OUT
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
body_outside_diameter	0.311 INCHES NOMINAL IN
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
current_rating_per_characteristic	160.00 MILLIAMPERES MAXIMUM SUPPLY
NSN	5962-01-263-3545

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY OUTSIDE DIAMETER: 0.311 INCHES NOMINAL IN

•

BODY WIDTH: 0.285 INCHES NOMINAL IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ASYNCHRONOUS AND EXPANDABLE AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 160.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY OUTSIDE DIAMETER	0.311 INCHES NOMINAL IN
BODY WIDTH	0.285 INCHES NOMINAL IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
FEATURES PROVIDED	ASYNCHRONOUS AND EXPANDABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	160.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	FIRST-IN FIRST-OUT
BODY LENGTH	0.968 INCHES NOMINAL IN

SUBSTITUTES & CROSS-REFERENCES 2

CY7C401-10DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

91469709Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is C57401AJ?

C57401AJ is a MICROCIRCUIT,MEMORY.

What parts can replace C57401AJ?

There are 2 known substitutes for C57401AJ: CY7C401-10DMB, 91469709. Substitute compatibility should be verified for your specific system.

What is the NSN for C57401AJ?

C57401AJ is cataloged in the U.S. Government catalog under NSN 5962-01-263-3545. This indicates validated use in U.S. government and defense supply chains.

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