C574000240 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

C574000240: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.670 INCHES MINIMUM AND 0.690 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN, body_length: 1.130 INCHES MINIMUM AND 1.150 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS AND W/STORAGE AND W/STROBE AND W/OPEN COLLECTOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: GLASS AND METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-062-2794, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

C574000240

NSN: 5962-01-062-2794
NIINs: 010622794, 011674714
FSC: 5962 — Microcircuits, Electronic
CAGE: 88818 — KEARFOTT CORPORATION DIV GUIDANCE AND NAVIGATION DIVISION (USA)

SPECIFICATIONS

body_width	0.670 INCHES MINIMUM AND 0.690 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
body_length	1.130 INCHES MINIMUM AND 1.150 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS AND W/STORAGE AND W/STROBE AND W/OPEN COLLECTOR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	GLASS AND METAL
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 100.0 CELSIUS DEGC
input_circuit_pattern	18 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-062-2794

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: GLASS AND METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.670 INCHES MINIMUM AND 0.690 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS AND W/STORAGE AND W/STROBE AND W/OPEN COLLECTOR

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: RAM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	GLASS AND METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.670 INCHES MINIMUM AND 0.690 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS AND W/STORAGE AND W/STROBE AND W/OPEN COLLECTOR
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.130 INCHES MINIMUM AND 1.150 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

5711670Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is C574000240?

C574000240 is a MICROCIRCUIT,DIGITAL.

What parts can replace C574000240?

There is 1 known substitute for C574000240: 5711670. Substitute compatibility should be verified for your specific system.

What is the NSN for C574000240?

C574000240 is cataloged in the U.S. Government catalog under NSN 5962-01-062-2794. This indicates validated use in U.S. government and defense supply chains.

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C574000240 — MICROCIRCUIT,DIGITAL

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