The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND W/CLEAR AND W/ENABLE AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-493-5966, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| body_height | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| body_length | 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND W/CLEAR AND W/ENABLE AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 4 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 FLAT LEADS |
| NSN | 5962-00-493-5966 |
| BODY HEIGHT | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K, CLOCKED AND 2 FLIP-FLOP, J-K, MASTER SLAVE |
| BODY WIDTH | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND W/CLEAR AND W/ENABLE AND POSITIVE OUTPUTS |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INCLOSURE CONFIGURATION | FLAT PACK |