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C2147 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

C2147: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND HIGH SPEED AND 3-STATE OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-116-5779, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
C2147
NSN: 5962-01-116-5779
NIINs: 011165779, 011936092
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)
SPECIFICATIONS
body_width0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
body_height0.140 INCHES MAXIMUM IN
body_length0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND HIGH SPEED AND 3-STATE OUTPUT
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern15 INPUT
end_item_identification6930-01-102-2345 36378
NSN5962-01-116-5779
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN C2147 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 15 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND HIGH SPEED AND 3-STATE OUTPUT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN15 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND HIGH SPEED AND 3-STATE OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
BODY LENGTH0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
7758026-01Reference document
Same NSN cross-reference
Reference document — Secondary reference
4014535-001Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is C2147?
C2147 is a MICROCIRCUIT,MEMORY.
What parts can replace C2147?
There are 2 known substitutes for C2147: 7758026-01, 4014535-001. Substitute compatibility should be verified for your specific system.
What is the NSN for C2147?
C2147 is cataloged in the U.S. Government catalog under NSN 5962-01-116-5779. This indicates validated use in U.S. government and defense supply chains.
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