C157B126: SEMICONDUCTOR DEVICE,THYRISTOR.
The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_width: 1.062 INCHES MAXIMUM IN, overall_height: 1.750 INCHES MAXIMUM IN, overall_length: 1.750 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-009-6325, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| overall_width | 1.062 INCHES MAXIMUM IN |
| overall_height | 1.750 INCHES MAXIMUM IN |
| overall_length | 1.750 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 1.500 INCHES IN |
| semiconductor_material | SILICON |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 2 TAB, SOLDER LUG AND 1 THREADED STUD |
| power_rating_per_characteristic | 2.0 WATTS MAXIMUM AVERAGE GATE POWER-FORWARD |
| NSN | 5961-01-009-6325 |
| OVERALL HEIGHT | 1.750 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 NOMINAL OFF-STATE VOLTAGE, RMS TOTAL |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| MOUNTING METHOD | THREADED STUD(S) |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 1.750 INCHES MAXIMUM IN |
| OVERALL WIDTH | 1.062 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| NOMINAL THREAD SIZE | 1.500 INCHES IN |