C-2117-2 — MICROCIRCUIT,MEMORY

✓ Government record, cited

Kurio · COMPONENT

PRODUCT OVERVIEW

C-2117-2: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a Kurio memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.790 INCHES MINIMUM AND 0.820 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND DYNAMIC AND LOW POWER AND 3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND W/BUFFERED OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-138-2048, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

C-2117-2

NSN: 5962-01-138-2048
NIINs: 011382048, 013675201
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.790 INCHES MINIMUM AND 0.820 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND DYNAMIC AND LOW POWER AND 3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND W/BUFFERED OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
end_item_identification	4920-00-001-5267 81755
NSN	5962-01-138-2048

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 11 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND DYNAMIC AND LOW POWER AND 3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND W/BUFFERED OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	11 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND DYNAMIC AND LOW POWER AND 3-STATE OUTPUT AND W/ENABLE AND W/STROBE AND W/BUFFERED OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.790 INCHES MINIMUM AND 0.820 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is C-2117-2?

C-2117-2 is a MICROCIRCUIT,MEMORY manufactured by Kurio.

What is the NSN for C-2117-2?

C-2117-2 is cataloged in the U.S. Government catalog under NSN 5962-01-138-2048. This indicates validated use in U.S. government and defense supply chains.

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C-2117-2 — MICROCIRCUIT,MEMORY

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