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BYT261PI-400 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

BYT261PI-400: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include mounting_method: SLOT AND UNTHREADED HOLE(S), terminal_type_and_quantity: 4 TAB, SOLDER LUG, capacitance_rating_in_picofarads: 45.0 NOMINAL, current_rating_per_characteristic: 800.00 AMPERES NOMINAL REPETITIVE PEAK FORWARD CURRENT, maximum_operating_temp_per_measurement_point: 150.0 CELSIUS JUNCTION DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-468-2802, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
BYT261PI-400
NSN: 5961-01-468-2802
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 0EU87 — AVNET INC. (USA)
SPECIFICATIONS
mounting_methodSLOT AND UNTHREADED HOLE(S)
mounting_facility_quantity2
terminal_type_and_quantity4 TAB, SOLDER LUG
capacitance_rating_in_picofarads45.0 NOMINAL
current_rating_per_characteristic800.00 AMPERES NOMINAL REPETITIVE PEAK FORWARD CURRENT
maximum_operating_temp_per_measurement_point150.0 CELSIUS JUNCTION DEGC
NSN5961-01-468-2802
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN BYT261PI-400 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 CELSIUS JUNCTION DEGC
•
MOUNTING FACILITY QUANTITY: 2
•
MOUNTING METHOD: SLOT AND UNTHREADED HOLE(S)
•
CAPACITANCE RATING IN PICOFARADS: 45.0 NOMINAL
•
CURRENT RATING PER CHARACTERISTIC: 800.00 AMPERES NOMINAL REPETITIVE PEAK FORWARD CURRENT
•
TERMINAL TYPE AND QUANTITY: 4 TAB, SOLDER LUG
TECHNICAL CHARACTERISTICS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 CELSIUS JUNCTION DEGC
MOUNTING FACILITY QUANTITY2
MOUNTING METHODSLOT AND UNTHREADED HOLE(S)
CAPACITANCE RATING IN PICOFARADS45.0 NOMINAL
CURRENT RATING PER CHARACTERISTIC800.00 AMPERES NOMINAL REPETITIVE PEAK FORWARD CURRENT
TERMINAL TYPE AND QUANTITY4 TAB, SOLDER LUG
SUBSTITUTES & CROSS-REFERENCES 3
BYT261PI(V)-400Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
10627589Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
STTH120R04TV1Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is BYT261PI-400?
BYT261PI-400 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace BYT261PI-400?
There are 3 known substitutes for BYT261PI-400: BYT261PI(V)-400, 10627589, STTH120R04TV1. Substitute compatibility should be verified for your specific system.
What is the NSN for BYT261PI-400?
BYT261PI-400 is cataloged in the U.S. Government catalog under NSN 5961-01-468-2802. This indicates validated use in U.S. government and defense supply chains.
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