BUWEPSDWG824231: CIRCUIT CARD ASSEMBLY.
The CIRCUIT CARD ASSEMBLY is a the manufacturer industrial component. Key specifications include material: COPPER ALLOY OVERALL, hole_diameter: 0.150 INCHES NOMINAL IN, overall_height: 0.125 INCHES NOMINAL IN, outside_diameter: 0.362 INCHES NOMINAL IN, style_designator: SPRING TENSION, surface_treatment: NICKEL OVERALL. This part is cataloged in the U.S.
Government catalog under NSN 1045-00-334-2689, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY OVERALL |
| hole_diameter | 0.150 INCHES NOMINAL IN |
| overall_height | 0.125 INCHES NOMINAL IN |
| outside_diameter | 0.362 INCHES NOMINAL IN |
| style_designator | SPRING TENSION |
| surface_treatment | NICKEL OVERALL |
| material_thickness | 0.015 INCHES NOMINAL IN |
| end_item_identification | AN/GPN-20,NAVAID RADAR |
| material_document_and_classification | QQ-P-330,COMP A,COND SPG FED SPEC SINGLE MATERIAL RESPONSE OVERALL |
| part_name_assigned_by_controlling_agency | CURRENT SENSOR |
| surface_treatment_document_and_classification | QQ-N-290 FED SPEC SINGLE TREATMENT RESPONSE OVERALL |
| NSN | 1045-00-334-2689 |
No substitute or cross-reference records for this part.