BUS66102-605: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.890 INCHES MINIMUM AND 1.900 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-356-7267, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.890 INCHES MINIMUM AND 1.900 INCHES MAXIMUM IN |
| features_provided | BURN IN AND ELECTROSTATIC SENSITIVE |
| inclosure_material | CERAMIC |
| storage_temp_range | -55.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 18 INPUT |
| hybrid_technology_type | MONOLITHIC |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 36 PIN |
| NSN | 5962-01-356-7267 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INPUT CIRCUIT PATTERN | 18 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 COUNTER AND 1 MULTIPLEXER AND 1 REGISTER |
| BODY WIDTH | 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | CAN |
| BODY LENGTH | 1.890 INCHES MINIMUM AND 1.900 INCHES MAXIMUM IN |