BUS63127II: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.695 INCHES MINIMUM AND 1.705 INCHES MAXIMUM IN, features_provided: LOW POWER AND HIGH RELIABILITY AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-376-4556, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.695 INCHES MINIMUM AND 1.705 INCHES MAXIMUM IN |
| features_provided | LOW POWER AND HIGH RELIABILITY AND BIPOLAR AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| hybrid_technology_type | MONOLITHIC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-376-4556 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 2 TRANSCEIVER |
| BODY WIDTH | 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | LOW POWER AND HIGH RELIABILITY AND BIPOLAR AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.695 INCHES MINIMUM AND 1.705 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
No substitute or cross-reference records for this part.