BUS61554II-883: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 1.800 INCHES NOMINAL IN, body_height: 0.250 INCHES MAXIMUM IN, body_length: 2.100 INCHES MAXIMUM IN, precious_material: GOLD, inclosure_material: CERAMIC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-398-3223, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.800 INCHES NOMINAL IN |
| body_height | 0.250 INCHES MAXIMUM IN |
| body_length | 2.100 INCHES MAXIMUM IN |
| precious_material | GOLD |
| inclosure_material | CERAMIC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| hybrid_technology_type | MONOLITHIC |
| end_item_identification | 2350-01-328-5964 |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 82 PIN |
| NSN | 5962-01-398-3223 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| PRECIOUS MATERIAL | GOLD |
| DESIGN FUNCTION AND QUANTITY | 1 ARITHMETIC LOGIC UNIT |
| BODY WIDTH | 1.800 INCHES NOMINAL IN |
| BODY HEIGHT | 0.250 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 2.100 INCHES MAXIMUM IN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |