BUS-8937-883B: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 1.140 INCHES NOMINAL IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.740 INCHES NOMINAL IN, features_provided: HYBRID AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-182-1815, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.140 INCHES NOMINAL IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.740 INCHES NOMINAL IN |
| features_provided | HYBRID AND 3-STATE OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC OR GLASS OR METAL |
| storage_temp_range | -55.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 32 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-182-1815 |
| INPUT CIRCUIT PATTERN | 32 INPUT |
| INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, PARALLEL TO SERIAL AND 1 CONVERTER, SERIAL TO PARALLEL |
| BODY WIDTH | 1.140 INCHES NOMINAL IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HYBRID AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.740 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -55.0 TO 150.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.