BUS-63125II-140 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

BUS-63125II-140: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.890 INCHES MINIMUM AND 1.900 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND HYBRID AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-310-6282, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

BUS-63125II-140

NSN: 5962-01-310-6282
FSC: 5962 — Microcircuits, Electronic
CAGE: 19645 — DATA DEVICE CORP DBA BETA TRANSFORMER TECHNOLOGY (USA)

SPECIFICATIONS

body_width	0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.890 INCHES MINIMUM AND 1.900 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND HYBRID AND LOW POWER
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	2 CHANNEL AND 12 INPUT
hybrid_technology_type	MULTICHIP
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-310-6282

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MULTICHIP

•

INPUT CIRCUIT PATTERN: 2 CHANNEL AND 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

DESIGN FUNCTION AND QUANTITY: 1 DRIVER AND 1 RECEIVER

•

BODY WIDTH: 0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HYBRID AND LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MULTICHIP
INPUT CIRCUIT PATTERN	2 CHANNEL AND 12 INPUT
INCLOSURE MATERIAL	CERAMIC
DESIGN FUNCTION AND QUANTITY	1 DRIVER AND 1 RECEIVER
BODY WIDTH	0.770 INCHES MINIMUM AND 0.780 INCHES MAXIMUM IN
BODY HEIGHT	0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND HYBRID AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	180.00 MILLIAMPERES NOMINAL OUTPUT
BODY LENGTH	1.890 INCHES MINIMUM AND 1.900 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 8

5962-8757901BXAReference document

Same NSN cross-reference

Reference document — Replaced / superseded reference

BUS-63125Reference document

Same NSN cross-reference

Reference document — Replaced / superseded reference

5962-8757902XASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-8757902XXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8757902XBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8757901BXBReference document

Same NSN cross-reference

Reference document — Replaced / superseded reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is BUS-63125II-140?

BUS-63125II-140 is a MICROCIRCUIT,DIGITAL.

What parts can replace BUS-63125II-140?

There are 8 known substitutes for BUS-63125II-140: 5962-8757901BXA, BUS-63125, 5962-8757902XA and 5 more. Substitute compatibility should be verified for your specific system.

What is the NSN for BUS-63125II-140?

BUS-63125II-140 is cataloged in the U.S. Government catalog under NSN 5962-01-310-6282. This indicates validated use in U.S. government and defense supply chains.

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