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BU-61687G3-601 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

BU-61687G3-601: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-589-6964, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
BU-61687G3-601
NSN: 5962-01-589-6964
FSC: 5962 — Microcircuits, Electronic
CAGE: 19645 — DATA DEVICE CORP DBA BETA TRANSFORMER TECHNOLOGY (USA)
SPECIFICATIONS
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
supplementary_featuresIS IN THE DDC MINI-ACE FAMILY; -601 REPRESENTS THAT THIS IS A NON-STANDARD PART NUMBER ASSIGNED TO A PARTICULAR CUSTOMER; PART HAS FORMED LEADS AND IS SOLDER DIPPED
NSN5962-01-589-6964
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN BU-61687G3-601 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
SUPPLEMENTARY FEATURES: IS IN THE DDC MINI-ACE FAMILY; -601 REPRESENTS THAT THIS IS A NON-STANDARD PART NUMBER ASSIGNED TO A PARTICULAR CUSTOMER; PART HAS FORMED LEADS AND IS SOLDER DIPPED
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
SUPPLEMENTARY FEATURESIS IN THE DDC MINI-ACE FAMILY; -601 REPRESENTS THAT THIS IS A NON-STANDARD PART NUMBER ASSIGNED TO A PARTICULAR CUSTOMER; PART HAS FORMED LEADS AND IS SOLDER DIPPED
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is BU-61687G3-601?
BU-61687G3-601 is a MICROCIRCUIT,MEMORY.
What is the NSN for BU-61687G3-601?
BU-61687G3-601 is cataloged in the U.S. Government catalog under NSN 5962-01-589-6964. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.