BU-61588P3-110: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include overall_width: 25.4 MILLIMETERS NOMINAL MM, overall_height: 3.81 MILLIMETERS MAXIMUM MM, overall_length: 25.4 MILLIMETERS NOMINAL MM, memory_capacity: 4K, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-642-0615, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 25.4 MILLIMETERS NOMINAL MM |
| overall_height | 3.81 MILLIMETERS MAXIMUM MM |
| overall_length | 25.4 MILLIMETERS NOMINAL MM |
| memory_capacity | 4K |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 CHANNEL |
| hybrid_technology_type | MULTICHIP |
| inclosure_configuration | PIN GRID ARRAY |
| terminal_surface_treatment | TIN |
| terminal_type_and_quantity | 81 PIN |
| NSN | 5962-01-642-0615 |
| OVERALL HEIGHT | 3.81 MILLIMETERS MAXIMUM MM |
| HYBRID TECHNOLOGY TYPE | MULTICHIP |
| INPUT CIRCUIT PATTERN | 2 CHANNEL |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | TIN |
| DESIGN FUNCTION AND QUANTITY | 1 MEMORY, RANDOM ACCESS |
| OVERALL LENGTH | 25.4 MILLIMETERS NOMINAL MM |
| OVERALL WIDTH | 25.4 MILLIMETERS NOMINAL MM |
| INCLOSURE CONFIGURATION | PIN GRID ARRAY |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.