BSD22: MODIFICATION KIT,RADAR EQUIPMENT.
MODIFICATION KIT,RADAR EQUIPMENT. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 1.4 MILLIMETERS MAXIMUM MM, overall_height: 1.1 MILLIMETERS MAXIMUM MM, overall_length: 3.0 MILLIMETERS MAXIMUM MM, mounting_method: TERMINAL, semiconductor_material: SILICON. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-457-9884, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 1.4 MILLIMETERS MAXIMUM MM |
| overall_height | 1.1 MILLIMETERS MAXIMUM MM |
| overall_length | 3.0 MILLIMETERS MAXIMUM MM |
| mounting_method | TERMINAL |
| semiconductor_material | SILICON |
| terminal_type_and_quantity | 4 TAB, SOLDER LUG |
| voltage_rating_in_volts_per_characteristic | 20.0 NOMINAL DRAIN TO SOURCE VOLTAGE |
| joint_electronic_device_engineering_council/jedec/case_outline_designation | SOT-143 |
| NSN | 5961-01-457-9884 |
| OVERALL HEIGHT | 1.1 MILLIMETERS MAXIMUM MM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 NOMINAL DRAIN TO SOURCE VOLTAGE |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-143 |
| MOUNTING METHOD | TERMINAL |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 3.0 MILLIMETERS MAXIMUM MM |
| OVERALL WIDTH | 1.4 MILLIMETERS MAXIMUM MM |
| MATERIAL | PLASTIC ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 4 TAB, SOLDER LUG |