The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, features_provided: MEDIUM SPEED AND HERMETICALLY SEALED AND W/BUFFERED OUTPUT, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-157-9447, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| features_provided | MEDIUM SPEED AND HERMETICALLY SEALED AND W/BUFFERED OUTPUT |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 WIDE 4 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| time_rating_per_chacteristic | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| NSN | 5962-01-157-9447 |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001AB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY HEIGHT | 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | 2 WIDE 4 INPUT |
| FEATURES PROVIDED | MEDIUM SPEED AND HERMETICALLY SEALED AND W/BUFFERED OUTPUT |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC |