BC419 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

BC419: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: CURRENT-MODE LOGIC, inclosure_material: GLASS AND METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-762-4792, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

BC419

NSN: 5962-00-762-4792
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

body_width	0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN
body_height	0.040 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_form	CURRENT-MODE LOGIC
inclosure_material	GLASS AND METAL
memory_device_type	DIODE MATRIX
storage_temp_range	-65.0 TO 200.0 CELSIUS DEGC
operating_temp_range	-65.0 TO 175.0 CELSIUS DEGC
input_circuit_pattern	2 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-00-762-4792

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 2 INPUT

•

INCLOSURE MATERIAL: GLASS AND METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.040 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: DIODE MATRIX

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	2 INPUT
INCLOSURE MATERIAL	GLASS AND METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN
BODY HEIGHT	0.040 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	DIODE MATRIX
CASE OUTLINE SOURCE AND DESIGNATOR	T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

FSA1520Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is BC419?

BC419 is a MICROCIRCUIT,MEMORY.

What parts can replace BC419?

There is 1 known substitute for BC419: FSA1520. Substitute compatibility should be verified for your specific system.

What is the NSN for BC419?

BC419 is cataloged in the U.S. Government catalog under NSN 5962-00-762-4792. This indicates validated use in U.S. government and defense supply chains.

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