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B2169 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

B2169: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.175 INCHES NOMINAL IN, body_length: 0.890 INCHES NOMINAL IN, special_features: ELECTROSTATIC DISCHARG SENSITIV, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-204-9759, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
B2169
NSN: 5962-01-204-9759
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.290 INCHES NOMINAL IN
body_height0.175 INCHES NOMINAL IN
body_length0.890 INCHES NOMINAL IN
special_featuresELECTROSTATIC DISCHARG SENSITIV
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
end_item_identificationF-15 AIRCRAFT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
criticality_code_justificationFEAT
NSN5962-01-204-9759
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN B2169 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.290 INCHES NOMINAL IN
•
BODY HEIGHT: 0.175 INCHES NOMINAL IN
•
CRITICALITY CODE JUSTIFICATION: FEAT
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
•
BODY LENGTH: 0.890 INCHES NOMINAL IN
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.290 INCHES NOMINAL IN
BODY HEIGHT0.175 INCHES NOMINAL IN
CRITICALITY CODE JUSTIFICATIONFEAT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
BODY LENGTH0.890 INCHES NOMINAL IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURESELECTROSTATIC DISCHARG SENSITIV
SUBSTITUTES & CROSS-REFERENCES 1
HM1-6561B-8Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is B2169?
B2169 is a MICROCIRCUIT,MEMORY.
What parts can replace B2169?
There is 1 known substitute for B2169: HM1-6561B-8. Substitute compatibility should be verified for your specific system.
What is the NSN for B2169?
B2169 is cataloged in the U.S. Government catalog under NSN 5962-01-204-9759. This indicates validated use in U.S. government and defense supply chains.
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