AT28C256F-15DM/883: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 15.5 MILLIMETERS MAXIMUM MM, body_height: 4.4 MILLIMETERS MAXIMUM MM, body_length: 37.8 MILLIMETERS MAXIMUM MM, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-394-6444, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 15.5 MILLIMETERS MAXIMUM MM |
| body_height | 4.4 MILLIMETERS MAXIMUM MM |
| body_length | 37.8 MILLIMETERS MAXIMUM MM |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EEPROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-394-6444 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 15.5 MILLIMETERS MAXIMUM MM |
| BODY HEIGHT | 4.4 MILLIMETERS MAXIMUM MM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| MEMORY DEVICE TYPE | EEPROM |
| BODY LENGTH | 37.8 MILLIMETERS MAXIMUM MM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |