AT28C010-12LM/883 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AT28C010-12LM/883: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND BURN IN, MIL-STD-883, CLASS B, inclosure_material: CERAMIC, memory_device_type: EEPROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-414-6702, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AT28C010-12LM/883

NSN: 5962-01-414-6702
FSC: 5962 — Microcircuits, Electronic
CAGE: 1FN41 — ATMEL CORPORATION (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND BURN IN, MIL-STD-883, CLASS B
inclosure_material	CERAMIC
memory_device_type	EEPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	F-16
inclosure_configuration	LEADLESS FLAT PACK
terminal_type_and_quantity	30 LEADLESS
criticality_code_justification	CBBL
NSN	5962-01-414-6702

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: CBBL

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND BURN IN, MIL-STD-883, CLASS B

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: EEPROM

•

BODY LENGTH: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	CBBL
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND BURN IN, MIL-STD-883, CLASS B
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	EEPROM
BODY LENGTH	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

3129345-0002Reference document

Same NSN cross-reference

Reference document — Vendor item drawing reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is AT28C010-12LM/883?

AT28C010-12LM/883 is a MICROCIRCUIT,MEMORY.

What parts can replace AT28C010-12LM/883?

There is 1 known substitute for AT28C010-12LM/883: 3129345-0002. Substitute compatibility should be verified for your specific system.

What is the NSN for AT28C010-12LM/883?

AT28C010-12LM/883 is cataloged in the U.S. Government catalog under NSN 5962-01-414-6702. This indicates validated use in U.S. government and defense supply chains.

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