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AT24C512BN-SH25-B — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

AT24C512BN-SH25-B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 6.00 MILLIMETERS NOMINAL MM, body_height: 1.75 MILLIMETERS NOMINAL MM, body_length: 4.90 MILLIMETERS NOMINAL MM, memory_capacity: 512, inclosure_material: PLASTIC, memory_device_type: EEPROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-710-4477, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AT24C512BN-SH25-B
NSN: 5962-01-710-4477
FSC: 5962 — Microcircuits, Electronic
CAGE: 60991 — MICROCHIP TECHNOLOGY INC (USA)
SPECIFICATIONS
body_width6.00 MILLIMETERS NOMINAL MM
body_height1.75 MILLIMETERS NOMINAL MM
body_length4.90 MILLIMETERS NOMINAL MM
memory_capacity512
inclosure_materialPLASTIC
memory_device_typeEEPROM
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
inclosure_configurationPIN GRID ARRAY
terminal_surface_treatmentSOLDER
terminal_type_and_quantity8 FLAT LEADS
part_name_assigned_by_controlling_agencyMEMORY MICROCIRCUIT
NSN5962-01-710-4477
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN AT24C512BN-SH25-B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: PLASTIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 6.00 MILLIMETERS NOMINAL MM
•
BODY HEIGHT: 1.75 MILLIMETERS NOMINAL MM
•
INCLOSURE CONFIGURATION: PIN GRID ARRAY
•
MEMORY DEVICE TYPE: EEPROM
•
BODY LENGTH: 4.90 MILLIMETERS NOMINAL MM
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALPLASTIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH6.00 MILLIMETERS NOMINAL MM
BODY HEIGHT1.75 MILLIMETERS NOMINAL MM
INCLOSURE CONFIGURATIONPIN GRID ARRAY
MEMORY DEVICE TYPEEEPROM
BODY LENGTH4.90 MILLIMETERS NOMINAL MM
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYMEMORY MICROCIRCUIT
TERMINAL TYPE AND QUANTITY8 FLAT LEADS
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is AT24C512BN-SH25-B?
AT24C512BN-SH25-B is a MICROCIRCUIT,MEMORY.
What is the NSN for AT24C512BN-SH25-B?
AT24C512BN-SH25-B is cataloged in the U.S. Government catalog under NSN 5962-01-710-4477. This indicates validated use in U.S. government and defense supply chains.
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