The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.140 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-542-7143, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.140 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| specification/standard_data | 80131-RELEASE2099 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| current_rating_per_characteristic | 6.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 50.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 175.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-542-7143 |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MOUNTING METHOD | TERMINAL |
| SPECIFICATION/STANDARD DATA | 80131-RELEASE2099 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| OVERALL DIAMETER | 0.140 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 0.300 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS AMBIENT AIR DEGC |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |