AM9218CDC31374 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM9218CDC31374: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 1.230 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-142-5124, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM9218CDC31374

NSN: 5962-01-142-5124
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	1.230 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND LOW POWER AND PROGRAMMED AND HIGH IMPEDANCE AND WIRE-OR OUTPUTS
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	SPECTRUM ANAL 28480
NSN	5962-01-142-5124

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND LOW POWER AND PROGRAMMED AND HIGH IMPEDANCE AND WIRE-OR OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND LOW POWER AND PROGRAMMED AND HIGH IMPEDANCE AND WIRE-OR OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.230 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

1818-0527Reference document

Same NSN cross-reference

Reference document — Secondary reference

MK34000P-3Reference document

Same NSN cross-reference

Reference document — Secondary reference

AM9218CDCReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM9218CDC31374?

AM9218CDC31374 is a MICROCIRCUIT,MEMORY.

What parts can replace AM9218CDC31374?

There are 3 known substitutes for AM9218CDC31374: 1818-0527, MK34000P-3, AM9218CDC. Substitute compatibility should be verified for your specific system.

What is the NSN for AM9218CDC31374?

AM9218CDC31374 is cataloged in the U.S. Government catalog under NSN 5962-01-142-5124. This indicates validated use in U.S. government and defense supply chains.

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