AM91L30BDMB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM91L30BDMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.380 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.060 INCHES MINIMUM AND 1.110 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 1024, features_provided: HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND LOW POWER AND W/ENABLE AND BIDIRECTIONAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-188-8747, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM91L30BDMB

NSN: 5962-01-188-8747
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.380 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
body_height	0.200 INCHES MAXIMUM IN
body_length	1.060 INCHES MINIMUM AND 1.110 INCHES MAXIMUM IN
bit_quantity	4096
word_quantity	1024
features_provided	HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND LOW POWER AND W/ENABLE AND BIDIRECTIONAL
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-188-8747

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 4096

•

INPUT CIRCUIT PATTERN: 19 INPUT

•

WORD QUANTITY: 1024

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.380 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.200 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND LOW POWER AND W/ENABLE AND BIDIRECTIONAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	4096
INPUT CIRCUIT PATTERN	19 INPUT
WORD QUANTITY	1024
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.380 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
BODY HEIGHT	0.200 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND LOW POWER AND W/ENABLE AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM91L30BDMB?

AM91L30BDMB is a MICROCIRCUIT,MEMORY.

What is the NSN for AM91L30BDMB?

AM91L30BDMB is cataloged in the U.S. Government catalog under NSN 5962-01-188-8747. This indicates validated use in U.S. government and defense supply chains.

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