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AM9050EDLB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

AM9050EDLB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.165 INCHES MAXIMUM IN, body_length: 0.910 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE, output_logic_form: P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-127-2146, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AM9050EDLB
NSN: 5962-01-127-2146
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.165 INCHES MAXIMUM IN
body_length0.910 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE
output_logic_formP-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
end_item_identificationPO OK-398 FSCM 05869
inclosure_configurationDUAL-IN-LINE
NSN5962-01-127-2146
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN AM9050EDLB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 13 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.165 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN13 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.165 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH0.910 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
DMSCASE84-065BReference document
Same NSN cross-reference
Reference document — Secondary reference
SMC4050-2JRReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is AM9050EDLB?
AM9050EDLB is a MICROCIRCUIT,MEMORY.
What parts can replace AM9050EDLB?
There are 2 known substitutes for AM9050EDLB: DMSCASE84-065B, SMC4050-2JR. Substitute compatibility should be verified for your specific system.
What is the NSN for AM9050EDLB?
AM9050EDLB is cataloged in the U.S. Government catalog under NSN 5962-01-127-2146. This indicates validated use in U.S. government and defense supply chains.
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