AM27S82DMB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S82DMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.490 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.195 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.410 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND W/OPEN COLLECTOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-217-8349, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S82DMB

NSN: 5962-01-217-8349
NIINs: 012178349, 012178350, 012178351, 012178461
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.490 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.195 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
overall_height	0.410 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND W/OPEN COLLECTOR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
NSN	5962-01-217-8349

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.490 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.195 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND W/OPEN COLLECTOR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.490 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.195 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND W/OPEN COLLECTOR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

4009238-505Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is AM27S82DMB?

AM27S82DMB is a MICROCIRCUIT,MEMORY.

What parts can replace AM27S82DMB?

There are 2 known substitutes for AM27S82DMB: 4009238-505, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S82DMB?

AM27S82DMB is cataloged in the U.S. Government catalog under NSN 5962-01-217-8349. This indicates validated use in U.S. government and defense supply chains.

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