AM27S45A/B3A — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S45A/B3A: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.450 INCHES MAXIMUM IN, body_height: 0.550 INCHES NOMINAL IN, body_length: 0.450 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: METAL OR CERAMIC OR PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-261-4043, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S45A/B3A

NSN: 5962-01-261-4043
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.450 INCHES MAXIMUM IN
body_height	0.550 INCHES NOMINAL IN
body_length	0.450 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	METAL OR CERAMIC OR PLASTIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	LEADED CHIP CARRIER
NSN	5962-01-261-4043

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: METAL OR CERAMIC OR PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.450 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.550 INCHES NOMINAL IN

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

CURRENT RATING PER CHARACTERISTIC: 185.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	METAL OR CERAMIC OR PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.450 INCHES MAXIMUM IN
BODY HEIGHT	0.550 INCHES NOMINAL IN
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
CURRENT RATING PER CHARACTERISTIC	185.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	C-4 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 4

5962-85527023ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-85527023BReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85527023XReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85527Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is AM27S45A/B3A?

AM27S45A/B3A is a MICROCIRCUIT,MEMORY.

What parts can replace AM27S45A/B3A?

There are 4 known substitutes for AM27S45A/B3A: 5962-85527023A, 5962-85527023B, 5962-85527023X and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S45A/B3A?

AM27S45A/B3A is cataloged in the U.S. Government catalog under NSN 5962-01-261-4043. This indicates validated use in U.S. government and defense supply chains.

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