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Technical Data Sheet

AM27S35/BKA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

AM27S35/BKA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.420 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE AND ASYNCHRONOUS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: METAL OR PLASTIC OR CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-262-3636, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AM27S35/BKA
NSN: 5962-01-262-3636
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.420 INCHES MAXIMUM IN
body_height0.090 INCHES MAXIMUM IN
body_length0.640 INCHES MAXIMUM IN
features_providedMONOLITHIC AND PROGRAMMABLE AND ASYNCHRONOUS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialMETAL OR PLASTIC OR CERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationFLAT PACK
NSN5962-01-262-3636
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN AM27S35/BKA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: METAL OR PLASTIC OR CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.420 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.090 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND ASYNCHRONOUS
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALMETAL OR PLASTIC OR CERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.420 INCHES MAXIMUM IN
BODY HEIGHT0.090 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND PROGRAMMABLE AND ASYNCHRONOUS
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
BODY LENGTH0.640 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 5
5962-8670701BKXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8670601BKBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-86706Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8670601KASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-8670601KXReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is AM27S35/BKA?
AM27S35/BKA is a MICROCIRCUIT,MEMORY.
What parts can replace AM27S35/BKA?
There are 5 known substitutes for AM27S35/BKA: 5962-8670701BKX, 5962-8670601BKB, 5962-86706 and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for AM27S35/BKA?
AM27S35/BKA is cataloged in the U.S. Government catalog under NSN 5962-01-262-3636. This indicates validated use in U.S. government and defense supply chains.
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