AM27S25ALMC — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S25ALMC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: SCHOTTKY AND HIGH PERFORMANCE AND W/ENABLE AND W/CLEAR AND W/PRESET, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-277-8710, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S25ALMC

NSN: 5962-01-277-8710
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_provided	SCHOTTKY AND HIGH PERFORMANCE AND W/ENABLE AND W/CLEAR AND W/PRESET
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-277-8710

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: SCHOTTKY AND HIGH PERFORMANCE AND W/ENABLE AND W/CLEAR AND W/PRESET

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	SCHOTTKY AND HIGH PERFORMANCE AND W/ENABLE AND W/CLEAR AND W/PRESET
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

795362-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM27S25ALMC?

AM27S25ALMC is a MICROCIRCUIT,MEMORY.

What parts can replace AM27S25ALMC?

There are 2 known substitutes for AM27S25ALMC: ROM/PROM, 795362-2. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S25ALMC?

AM27S25ALMC is cataloged in the U.S. Government catalog under NSN 5962-01-277-8710. This indicates validated use in U.S. government and defense supply chains.

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