AM27S19APC — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S19APC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include overall_height: 0.185 INCHES MAXIMUM IN, overall_length: 0.840 INCHES MAXIMUM IN, overall_diameter: 0.310 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND SCHOTTKY AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-346-1907, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S19APC

NSN: 5962-01-346-1907
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

overall_height	0.185 INCHES MAXIMUM IN
overall_length	0.840 INCHES MAXIMUM IN
overall_diameter	0.310 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND SCHOTTKY AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-346-1907

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

OVERALL DIAMETER: 0.310 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND SCHOTTKY AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.185 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
OVERALL DIAMETER	0.310 INCHES MAXIMUM IN
OVERALL LENGTH	0.840 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND SCHOTTKY AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	250.00 MILLIAMPERES MAXIMUM OUTPUT
MEMORY DEVICE TYPE	PROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

5016683-001Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM27S19APC?

AM27S19APC is a MICROCIRCUIT,MEMORY.

What parts can replace AM27S19APC?

There are 2 known substitutes for AM27S19APC: 5016683-001, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S19APC?

AM27S19APC is cataloged in the U.S. Government catalog under NSN 5962-01-346-1907. This indicates validated use in U.S. government and defense supply chains.

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