AM27S19A/BFA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S19A/BFA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: METAL OR PLASTIC OR CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-262-2965, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S19A/BFA

NSN: 5962-01-262-2965
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.285 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.440 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	METAL OR PLASTIC OR CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-262-2965

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: METAL OR PLASTIC OR CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	METAL OR PLASTIC OR CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	F-5 MIL-M-38510
BODY LENGTH	0.440 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 8

5962-8670302BFXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8670302BFAReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8670302BFBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8670302FBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8670302FASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-86703Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM27S19A/BFA?

AM27S19A/BFA is a MICROCIRCUIT,MEMORY.

What parts can replace AM27S19A/BFA?

There are 8 known substitutes for AM27S19A/BFA: 5962-8670302BFX, 5962-8670302BFA, 5962-8670302BFB and 5 more. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S19A/BFA?

AM27S19A/BFA is cataloged in the U.S. Government catalog under NSN 5962-01-262-2965. This indicates validated use in U.S. government and defense supply chains.

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