AM27S191A/BJA — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES NOMINAL IN, body_length: 1.290 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEMS, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND HIGH IMPEDANCE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-158-8947, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S191A/BJA

NSN: 5962-01-158-8947
FSC: 5962
CAGE: FAH01 — 2 MB DISTRIBUTION (FRA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.210 INCHES NOMINAL IN
body_length	1.290 INCHES MAXIMUM IN
special_features	NUCLEAR HARDNESS CRITICAL ITEMS
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND HIGH IMPEDANCE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
NSN	5962-01-158-8947

COMPONENT DIAGRAM

KEY FEATURES

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL SURFACE TREATMENT: SOLDER

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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MEMORY DEVICE TYPE: ROM

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TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

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CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT	SOLDER
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC AND GLASS
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND HIGH IMPEDANCE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 16

77A100970Interchangeable