AM27S191/BUA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S191/BUA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.550 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.550 INCHES MAXIMUM IN, special_features: WEAPON SYSTEM ESSENTIAL, features_provided: MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-314-9748, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S191/BUA

NSN: 5962-01-314-9748
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.550 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	0.550 INCHES MAXIMUM IN
special_features	WEAPON SYSTEM ESSENTIAL
features_provided	MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
NSN	5962-01-314-9748

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.550 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.550 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	C-12 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 3

27S191Reference document

Same NSN cross-reference

Reference document — Secondary reference

G281950-864Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is AM27S191/BUA?

AM27S191/BUA is a MICROCIRCUIT,MEMORY.

What parts can replace AM27S191/BUA?

There are 3 known substitutes for AM27S191/BUA: 27S191, G281950-864, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S191/BUA?

AM27S191/BUA is cataloged in the U.S. Government catalog under NSN 5962-01-314-9748. This indicates validated use in U.S. government and defense supply chains.

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