AM27S19/BFA — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM27S19/BFA: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-379-9972, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S19/BFA

NSN: 5962-01-379-9972
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.285 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.440 INCHES MAXIMUM IN
features_provided	3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	81349-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-379-9972

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: PROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	3-STATE OUTPUT
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	F-5 MIL-M-38510
BODY LENGTH	0.440 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 6

5962-8670301FXReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM HEAD 019Reference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8670301FASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-86703Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8670301FBReference document

Same NSN cross-reference

Reference document — Secondary reference

82S123A/BFAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is AM27S19/BFA?

AM27S19/BFA is a MICROCIRCUIT,DIGITAL.

What parts can replace AM27S19/BFA?

There are 6 known substitutes for AM27S19/BFA: 5962-8670301FX, ROM/PROM HEAD 019, 5962-8670301FA and 3 more. Substitute compatibility should be verified for your specific system.

What is the NSN for AM27S19/BFA?

AM27S19/BFA is cataloged in the U.S. Government catalog under NSN 5962-01-379-9972. This indicates validated use in U.S. government and defense supply chains.

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