Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: AM27S185ADM

AM27S185ADM ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN, body_length: 0.870 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH SPEED AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-135-5707, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27S185ADM

NSN: 5962-01-135-5707
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN
body_length	0.870 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH SPEED AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-135-5707

COMPONENT DIAGRAM

KEY FEATURES

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BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: ROM

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TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT

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TIME RATING PER CHACTERISTIC: 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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MEMORY CAPACITY: UNKNOWN

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OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.130 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC	35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY CAPACITY	UNKNOWN
OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 5

8071825-023Interchangeable