AM27S13DMB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-162-3894, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.840 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND HIGH SPEED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| NSN | 5962-01-162-3894 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND BURN IN AND PROGRAMMED AND SCHOTTKY AND W/ACTIVE PULL-UP AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |