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AM27S12DM — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

AM27S12DM: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: PROGRAMMED 512 X 4 PROM, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-124-4295, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AM27S12DM
NSN: 5962-01-124-4295
NIINs: 011244295, 013667467
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
memory_capacityUNKNOWN
special_featuresPROGRAMMED 512 X 4 PROM
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
NSN5962-01-124-4295
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN AM27S12DM MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN10 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/204 GOVERNMENT SPECIFICATION
SUBSTITUTES & CROSS-REFERENCES 9
HM1-7620-8Reference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
0100-1313-CReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
M38510/20401BEBReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM HEAD 025Reference document
Same NSN cross-reference
Reference document — Secondary reference
M38510/20401BEXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-3820401BEAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is AM27S12DM?
AM27S12DM is a MICROCIRCUIT,MEMORY.
What parts can replace AM27S12DM?
There are 9 known substitutes for AM27S12DM: HM1-7620-8, 0100-1313-C, M38510/20401BEB and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for AM27S12DM?
AM27S12DM is cataloged in the U.S. Government catalog under NSN 5962-01-124-4295. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.