AM27C64-70DC: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.550 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 0.620 INCHES MAXIMUM IN, overall_height: 0.355 INCHES NOMINAL IN, overall_length: 1.280 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-319-0513, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.550 INCHES MAXIMUM IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.280 INCHES MAXIMUM IN |
| overall_width | 0.620 INCHES MAXIMUM IN |
| overall_height | 0.355 INCHES NOMINAL IN |
| overall_length | 1.280 INCHES MAXIMUM IN |
| features_provided | BIPOLAR AND BURN IN AND ERASABLE AND HIGH PERFORMANCE AND HIGH SPEED AND LOW POWER AND PROGRAMMABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| NSN | 5962-01-319-0513 |
| OVERALL HEIGHT | 0.355 INCHES NOMINAL IN |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.550 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| OVERALL LENGTH | 1.280 INCHES MAXIMUM IN |
| OVERALL WIDTH | 0.620 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BIPOLAR AND BURN IN AND ERASABLE AND HIGH PERFORMANCE AND HIGH SPEED AND LOW POWER AND PROGRAMMABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |