AM2764A-3DC — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM2764A-3DC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.371 INCHES MINIMUM AND 0.405 INCHES MAXIMUM IN, body_height: 0.270 INCHES MAXIMUM IN, body_length: 1.620 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-295-4576, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM2764A-3DC

NSN: 5962-01-295-4576
NIINs: 012954576, 013085507
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.371 INCHES MINIMUM AND 0.405 INCHES MAXIMUM IN
body_height	0.270 INCHES MAXIMUM IN
body_length	1.620 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	ERASABLE AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-295-4576

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN
BODY HEIGHT	0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.440 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

M2764A-3F1Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM2764A-3DC?

AM2764A-3DC is a MICROCIRCUIT,MEMORY.

What parts can replace AM2764A-3DC?

There are 2 known substitutes for AM2764A-3DC: M2764A-3F1, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for AM2764A-3DC?

AM2764A-3DC is cataloged in the U.S. Government catalog under NSN 5962-01-295-4576. This indicates validated use in U.S. government and defense supply chains.

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