AM27128A-25/BUA — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-243-1011, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM27128A-25/BUA

NSN: 5962-01-243-1011
FSC: 5962
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	18 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-243-1011

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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TERMINAL TYPE AND QUANTITY: 32 LEADLESS

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MEMORY DEVICE TYPE: PROM

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TIME RATING PER CHACTERISTIC: 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

CASE OUTLINE SOURCE AND DESIGNATOR: C-12 MIL-M-38510

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 0.6 VOLTS MINIMUM TOTAL SUPPLY AND 6.3 VOLTS MAXIMUM TOTAL SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
TERMINAL SURFACE TREATMENT	SOLDER
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	32 LEADLESS
MEMORY DEVICE TYPE	PROM
TIME RATING PER CHACTERISTIC	250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
CASE OUTLINE SOURCE AND DESIGNATOR	C-12 MIL-M-38510
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	0.6 VOLTS MINIMUM TOTAL SUPPLY AND 6.3 VOLTS MAXIMUM TOTAL SUPPLY
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	18 INPUT

VERIFIED SUBSTITUTES & CROSS-REFERENCES 31

82025Interchangeable