AM26S12/BFA: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-104-1698, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.285 INCHES MAXIMUM IN |
| body_height | 0.085 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-104-1698 |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 4 TRANSCEIVER |
| BODY WIDTH | 0.300 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND SCHOTTKY AND HIGH SPEED AND W/OPEN COLLECTOR AND W/ENABLE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.410 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.