AM26S10FM-B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM26S10FM-B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.370 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-198-7117, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM26S10FM-B

NSN: 5962-01-198-7117
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length	0.370 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND BURN IN
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	QUAD 2 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	16 FLAT LEADS
NSN	5962-01-198-7117

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: QUAD 2 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 4 TRANSCEIVER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND BURN IN

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	QUAD 2 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	4 TRANSCEIVER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND BURN IN
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.370 INCHES MINIMUM AND 0.425 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

AM26S10/BFAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is AM26S10FM-B?

AM26S10FM-B is a MICROCIRCUIT,DIGITAL.

What parts can replace AM26S10FM-B?

There is 1 known substitute for AM26S10FM-B: AM26S10/BFA. Substitute compatibility should be verified for your specific system.

What is the NSN for AM26S10FM-B?

AM26S10FM-B is cataloged in the U.S. Government catalog under NSN 5962-01-198-7117. This indicates validated use in U.S. government and defense supply chains.

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