AM25S08FMB — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

AM25S08FMB: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND EDGE TRIGGERED AND W/ENABLE AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-180-8299, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

AM25S08FMB

NSN: 5962-01-180-8299
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
body_height	0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length	0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND EDGE TRIGGERED AND W/ENABLE AND HIGH SPEED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-180-8299

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 4 REGISTER, D-TYPE

•

BODY WIDTH: 0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND EDGE TRIGGERED AND W/ENABLE AND HIGH SPEED

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	4 REGISTER, D-TYPE
BODY WIDTH	0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
BODY HEIGHT	0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND EDGE TRIGGERED AND W/ENABLE AND HIGH SPEED
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

7564558-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is AM25S08FMB?

AM25S08FMB is a MICROCIRCUIT,DIGITAL.

What parts can replace AM25S08FMB?

There is 1 known substitute for AM25S08FMB: 7564558-001. Substitute compatibility should be verified for your specific system.

What is the NSN for AM25S08FMB?

AM25S08FMB is cataloged in the U.S. Government catalog under NSN 5962-01-180-8299. This indicates validated use in U.S. government and defense supply chains.

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