AM25LS2569/BSA: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.092 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND SYNCHRONOUS AND BIPOLAR, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-198-9634, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.300 INCHES MAXIMUM IN |
| body_height | 0.092 INCHES MAXIMUM IN |
| body_length | 0.540 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND SYNCHRONOUS AND BIPOLAR |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | TIN |
| NSN | 5962-01-198-9634 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 COUNTER, UP/DOWN |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 0.490 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |