AM0983-004: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.909 INCHES MAXIMUM IN, body_height: 0.066 INCHES MAXIMUM IN, body_length: 0.909 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-340-1848, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.909 INCHES MAXIMUM IN |
| body_height | 0.066 INCHES MAXIMUM IN |
| body_length | 0.909 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADED CHIP CARRIER |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 64 FLAT LEADS |
| NSN | 5962-01-340-1848 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONTROL, MEMORY ACCESS |
| BODY WIDTH | 0.909 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.066 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CURRENT RATING PER CHARACTERISTIC | 75.00 MILLIAMPERES MAXIMUM SUPPLY |
| BODY LENGTH | 0.909 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |